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MR25H40
3. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
This device contains circuitry to protect the inputs against damage caused by high static voltages or
electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage
greater than maximum rated voltages to these high-impedance (Hi-Z) circuits.
The device also contains protection against external magnetic fields. Precautions should be taken to avoid
application of any magnetic field more intense than the field intensity specified in the maximum ratings.
Table 3.1 Absolute Maximum Ratings 1
Parameter
Supply voltage 2
Voltage on any pin 2
Output current per pin
Package power dissipation 3
Temperature under bias
MR25H40C (Industrial)
Temperature under bias
MR25H40M (AEC-Q100 Grade 1)
Storage Temperature
Lead temperature during solder (3 minute max)
Maximum magnetic field during write
Maximum magnetic field during read or standby
Symbol
V DD
V IN
I OUT
P D
T BIAS
T BIAS
T stg
T Lead
H max_write
H max_read
Value
-0.5 to 4.0
-0.5 to V DD + 0.5
±20
0.600
-45 to 95
-45 to 135
-55 to 150
260
12,000
12,000
Unit
V
V
mA
W
°C
°C
°C
°C
A/m
A/m
Permanent device damage may occur if absolute maximum ratings are exceeded. Functional opera-
All voltages are referenced to V SS . The DC value of V IN must not exceed actual applied V DD by more
Power dissipation capability depends on package characteristics and use environment.
1
tion should be restricted to recommended operating conditions. Exposure to excessive voltages or
magnetic fields could affect device reliability.
2
than 0.5V. The AC value of V IN must not exceed applied V DD by more than 2V for 10ns with I IN limited
to less than 20mA.
3
Everspin Technologies ? 2011
10
MR25H40 Rev. 5, 11/2011
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